Hot Sale Turn HDI Double Sided Rigid-Flex PCB Circuit Boards Design pcb factory

Overview

Description:

Rigid-flex is especially valuable in applications where space is limited, weight is a constraint, or electronics are subject to mechanical motion. These designs eliminate the need for bulky connectors and cables between rigid boards, improving durability and reducing assembly complexity.

 

Applications:

Small size, high reliability, and suitable for complex structural designs; main application areas: consumer and BMS, Automated equipment.

 

Specifications:

Feature	Capability	Process Capability	Standard	Speciation
Layer	26L	Min.Trace Width/Space	3mil	2mil
Min. Track/Spacing	0.065 mm/0.065 mm	Hole size(drilling)	Φ6mil	Φ2mil(laser)
Min. Hole/pa Size	0.10/0.35 mm	Hole size(punching)	Φ20mil	Φ20mil
Rigid-Flex Thickness	0.25-6.0mm	Min. via hole ring	Φ6mil	Φ5mil
MAX CU Thickness	4 OZ	Aspect ratio limits(through holes)	8:1	10:1 (hole size≧D0.30mm)
Drilling accuracy	+/-0.05 mm	Aspect ratio limits(blind holes)	1:1	1:1
PTH diameter tolerance	+/-0.05 mm	Layer registration	±3mils	±2mils (LDI)
MAX WPNL SIZE	620 mm × 500 mm
Finish copper (Flex Part)	0.5-2oz
Finish copper (Rigid Part)	1-4oz
Surface treatment	ENIG, Electric gold, IM-Ag, Electric Ag, HASL, HASL-LF, IM-Sn, Electric Sn, OSP, Caborn, Pt, NI-Pd-AU
Max board thickness: PTH diameter	13:1
Build time	7-20 days
RFQ	1-2 days

 

Competitive Advantage:

The versatility of rigid-flex circuit board layouts enables complex and innovative designs that can adapt to non-planar surfaces and accommodate unique geometric shapes, thus pushing the boundaries of electronic device design. The adoption of rigid-flex PCB technology can contribute to more sustainable and environmentally friendly electronic devices by reducing material waste and promoting energy-efficient designs. while rigid circuit areas provide stability and strength for other areas of the product that need increased durability and shock absorption.