Rigid - Flex PCB

Overview

Rigid-flex is especially valuable in applications where space is limited, weight is a constraint, or electronics are subject to mechanical motion. These designs eliminate the need for bulky connectors and cables between rigid boards, improving durability and reducing assembly complexity.

 

Applications

Small size, high reliability, and suitable for complex structural designs; main application areas: consumer and BMS, Automated equipment.

 

Specifications

Feature	Capability	Process Capability	Standard	Speciation
Layer	26L	Min.Trace Width/Space	3mil	2mil
Min. Track/Spacing	0.065 mm/0.065 mm	Hole size(drilling)	Φ6mil	Φ2mil(laser)
Min. Hole/pa Size	0.10/0.35 mm	Hole size(punching)	Φ20mil	Φ20mil
Rigid-Flex Thickness	0.25-6.0mm	Min. via hole ring	Φ6mil	Φ5mil
MAX CU Thickness	4 OZ	Aspect ratio limits(through holes)	8:1	10:1 (hole size≧D0.30mm)
Drilling accuracy	+/-0.05 mm	Aspect ratio limits(blind holes)	1:1	1:1
PTH diameter tolerance	+/-0.05 mm	Layer registration	±3mils	±2mils (LDI)
MAX WPNL SIZE	620 mm × 500 mm
Finish copper (Flex Part)	0.5-2oz
Finish copper (Rigid Part)	1-4oz
Surface treatment	ENIG, Electric gold, IM-Ag, Electric Ag, HASL, HASL-LF, IM-Sn, Electric Sn, OSP, Caborn, Pt, NI-Pd-AU
Max board thickness: PTH diameter	13:1
Build time	7-20 days
RFQ	1-2 days

 

Competitive Advantage

The versatility of rigid-flex circuit board layouts enables complex and innovative designs that can adapt to non-planar surfaces and accommodate unique geometric shapes, thus pushing the boundaries of electronic device design. The adoption of rigid-flex PCB technology can contribute to more sustainable and environmentally friendly electronic devices by reducing material waste and promoting energy-efficient designs. while rigid circuit areas provide stability and strength for other areas of the product that need increased durability and shock absorption.