Multilayers PCB

Overview

Multilayer PCB (Printed Circuit Board) is an advanced type of circuit board that consists of multiple layers of conductive pathways and insulating material. Unlike single-sided or double-sided PCBs, which have only one or two layers, multilayer PCBs can have three or more layers stacked together. The following table shows the difference between multi-layer circuit boards and single-sided and double-sided circuit boards.

 

Specifications

4-layers PCB
Layer	Material	Thickness (mm)	Thickness after lamination(mm)
L1-CU	Outer Base Copper 0.5OZ	0.0175 0.196 0.035 1.03 0.035 0.196 0.0175	0.0175
PP	7628 RC46%		(Plating to 1OZ)
	DK:4.74		0.1855
L2-CU	Inner Copper 1OZ		1.1
CORE	Core		(Core with Cu)
	DK:4.6
L3-CU	Inner Copper 1OZ
PP	7628 RC46%		0.1855
	DK:4.74		0.0175
L4-CU	Outer Base Copper 0.5OZ		(Plating to 1OZ)

 

Competitive Advantage

Multilayer printed circuit boards consist of multiple layers of conductive material separated by insulating layers. This structure allows for complex circuits and high component density. The outer layers are defined as the top and bottom layers, which are usually covered with protective materials and provide connection points for electronic components. The inner layers are defined as signal layers, power ground layers, and plane layers. Below is a breakdown of the basic structure of a multilayer PCB.